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Heat spreader - メーカー・企業と業務用製品 | イプロスものづくり

Heat spreaderの製品一覧

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High Thermal Conductivity Product Series

High Thermal Conductivity Product Series

Solve the problems of strict temperature control and high efficiency! A range of high thermal conductivity products exceeding 1000 W/m-K.

The "High Thermal Conductivity Product Series" consists of products developed using highly oriented graphite TPG and sealing/metallization technology, with thermal conductivity exceeding 1000 W/m-K. These products are ideal for heat dissipation and cooling of control boards and semiconductor devices, as well as for eliminating heat spots. 【Product Examples】 ■ Heat spreader for substrate cooling: TC-1050 ■ Thin laminate: TMP-FX ■ Heat sink for chip cooling: TMP-EX *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Other electronic parts
  • Heat spreader

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Heat spreader "TDMC CVD diamond insert"

Heat spreader "TDMC CVD diamond insert"

A diamond heat spreader that efficiently cools only the hotspots. Contributes to improved device performance and reliability.

The Diamond Heat Spreader "TDMC CVD Diamond Insert" quickly disperses heat from the heat source due to its high thermal conductivity of up to 2,000 W/m·K, efficiently cooling only the hotspots that significantly contribute to performance degradation and shortened lifespan, thereby enhancing device performance and reliability. It can be easily integrated into various packages such as QFN, BGA, and SiP, allowing for implementation with minimal changes to the overall system design. We also offer CVD diamond inserts tailored to your design and OEM-compatible thermal management solutions. 【Features】 ■ High thermal conductivity of up to 2,000 W/m·K ■ Thermal management leveraging the unique high thermal conductivity of diamond ■ Contributes to longer device lifespan and performance maintenance ■ Easily integrable into various packages such as QFN, BGA, and SiP *You can view the introduction materials for TDMC's diamond materials by clicking the download button below. Please feel free to contact us regarding this product.

  • Inserter
  • Heat spreader

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Heat spreader "TDMC CVD diamond insert"

Heat spreader "TDMC CVD diamond insert"

A diamond heat spreader that efficiently cools only the hotspots. Contributes to improved device performance and reliability.

The Diamond Heat Spreader "TDMC CVD Diamond Insert" quickly disperses heat from the heat source due to its high thermal conductivity of up to 2,000 W/m·K, efficiently cooling only the hotspots that significantly contribute to performance degradation and shortened lifespan, thereby enhancing device performance and reliability. It can be easily integrated into various packages such as QFN, BGA, and SiP, allowing for implementation with minimal design changes to the overall system. We also offer CVD diamond inserts tailored to your design and OEM-compatible thermal management solutions. 【Features】 ■ High thermal conductivity of up to 2,000 W/m·K ■ Thermal management leveraging the unique high thermal conductivity of diamond ■ Contributes to longer device lifespan and performance maintenance ■ Easily integrated into various packages such as QFN, BGA, and SiP *You can view the introduction materials for TDMC's diamond materials from the download button below. Please feel free to contact us regarding this product.

  • Inserter
  • Heat spreader

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

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